Advanced Manufacturing Capabilities
Smart Manufacturing for Reliable Storage
Aurora Storage operates internationally standardized, class-1000 clean smart manufacturing centers with in-house advanced packaging & testing lines and memory module production lines, delivering industry-leading yield and capacity.
In-House Production Capacity
100KK/yr
Planned chip packaging & testing capacity on our in-house memory chip packaging and testing line.
30KK/yr
Planned memory module manufacturing capacity on our in-house module production line.
Company Introduction
Shenzhen Aurora Storage Technology Co., Ltd. focuses on the R&D, design and sales of embedded storage chips, memory modules, portable storage and other products. Main products include eMMC, eMCP, ePOP, nMCP, UFS, SPI NAND, LPDDR, DDR, SSD, PSSD, Memory Card, memory modules and USB flash drives. They are widely used in smart terminals, smart wearables, smart homes, IoT, network communication, industrial control equipment, automotive electronics, smart healthcare and other fields.
With a high starting point, high quality and high efficiency, Aurora Storage upholds the core values of “integrity, reliability, efficiency, innovation and progress” and the philosophy of “based on high quality, driving new technology.” We strive to become an ultra-reliable storage innovation solution provider, making storage more efficient and data more reliable, building a new world of intelligent interconnection.
Our Smart Manufacturing Facilities
Class-1000 Cleanroom Packaging & Testing Line
SMT & Reflow Assembly Line
SMT Mounter Line
Production Line Operation
QC & Finished Goods Area
Aging & BQA Testing
Packaging Area
Cleanroom Production Area
Warehouse Storage
Warehouse & Logistics
Clean Smart Manufacturing Center
Our class-1000 clean smart manufacturing center pairs international high-end automated packaging equipment with strict in-process quality management, achieving an overall product yield of 99.98%.
Class-1000 Cleanroom
Internationally standardized clean smart manufacturing environment for chip packaging and module assembly.
Automated Equipment
International high-end automated packaging & testing equipment with strict in-process quality management.
99.98% Yield
Overall product yield ensured by standardized test verification and continuous process improvement.
Advanced Packaging Technology
Developing advanced packaging processes in-house — the only domestic manufacturer achieving 2nd-gen Flip Chip, plus 16-layer stacked die packaging.
2nd-gen FlipChip
Advanced FlipChip packaging, the only domestic manufacturer achieving 2nd-gen Flip Chip technology.
16-Layer Stacked Die
16-layer stacked die packaging for high-density, high-capacity storage solutions.
Multiple Package Types
FlipChip, SIP and CSP package forms supporting a wide range of product scenarios.
High-Speed Design
High-speed hardware design & modeling for next-generation memory products.
R&D & Test Team
100
Firmware & software R&D and product test engineers, with core members holding 10+ years of industry experience.
100M+
Chips shipped from dozens of firmware mass-production and large-scale test projects.
Standardized
Standardized test & verification process with mainstream vendor and controller resources.
Partner With Aurora Storage
Get in touch to discuss your storage requirements and how our manufacturing capabilities can support your project.