Memory Chip / Storage Products & Solution Provider
Make Storage More Efficient,
Make Data More Reliable
Shenzhen Aurora Storage Technology Co., Ltd. designs, develops and markets embedded storage chips, solid-state drives, DRAM memory modules and portable storage, delivering one-stop customized storage solutions to customers worldwide.
Our Product Lines
Embedded Storage Chips
eMMC 5.1, Mini eMMC, WelC industrial eMMC, UFS 3.1/2.2, LPDDR5X/4X, ePOP, uMCP, SPI NAND and DDR4. High integration, high speed and low power for smart terminals, wearables, IoT and automotive.
Solid-State Drives (SSD)
PCIe 5.0 / 4.0 / 3.0 NVMe M.2 and 2.5 inch SATA III drives from 256GB to 8TB for desktops, laptops, gaming, AI storage, workstations, industrial and Xinchuang ecosystems.
DRAM Memory Modules
LPCAMM2, DDR5 and DDR4 U-DIMM / SODIMM modules up to 128GB, premium chips for laptops, PCs, workstations, edge and automation equipment.
Portable Storage
Portable SSDs up to 4TB, microSD Express, SD 7.0, wide-temperature and consumer microSD cards, for backup, gaming, dashcams, drones, surveillance and mobile office.
Why Choose Aurora Storage
99.98%
International high-end automated packaging equipment and strict in-process quality management systematically ensure and monitor the overall product yield.
16-layer Stacked Die Packaging
SDBG ultra-thin 30µm mass production enables 16-layer stacked Die packaging. Packaging density, transmission rate and overall performance are greatly improved, with yield reaching industry-leading level.
100M+
Aurora Storage has cumulatively packaged and tested billions of various chips, meeting market demand for high-performance, high-quality chips.
2nd-gen FlipChip Advanced Packaging
The only domestic manufacturer achieving 2nd-gen Flip Chip advanced packaging, building a diversified packaging & testing business model.
Two Storage Brands
Aurora serves every scenario with two product grades — from everyday smart devices to mission-critical aerospace applications.
Consumer & Industrial Grade
High-reliability storage for everyday smart devices and industrial equipment, balancing performance, stability and cost.
Enterprise & Aerospace Grade
Mission-critical storage for data centers, aerospace and satellites, engineered for extreme reliability and endurance.
Advanced Manufacturing Capabilities
Internationally standardized, class-1000 clean smart manufacturing center with in-house advanced packaging & testing lines.
100KK/yr
Planned chip packaging capacity on our in-house memory chip packaging & testing line.
30KK/yr
Planned memory module manufacturing capacity on our in-house module production line.
Developing advanced packaging processes in-house and continuously introducing international advanced packaging & testing equipment enables rapid product iteration and process leadership, delivering smart manufacturing capacity that meets the storage demands of future AI applications.
Widely Applied Across Industries
One-Stop Storage Solutions and Customized Services
We provide global customers with one-stop storage solutions and customized product services.
OEM / ODM Custom Chip Solutions
Custom chip solution matched to your target application and budget.
Custom Capacity, Packaging & Labeling
Flexible capacity, package form factor, labeling and packaging customization.
Custom Read/Write Speed Tuning
Firmware tuning optimized for your performance and reliability requirements.
Custom Logo and Branding
Custom logo, package color and retail packaging options available.
Industrial & Wide-Temp Options
Industrial-grade and wide-temperature product lines for harsh environments.
Global Sales & Technical Support
Responsive global sales, sampling, documentation and Design-in support.
* We also welcome partnerships with memory module manufacturers, delivering finished products with customized customer logos.