Technology and Capabilities
Advanced Packaging, In-House Firmware, Smart Manufacturing
Advanced Technology
High-Speed Hardware Design and Simulation
From base boards to high-end multi-layer rigid boards, we perform high-speed hardware design, modeling and simulation to greatly reduce design iteration cycles.
Multi-Type Hardware Packaging Design
Complete base-board and packaging design capabilities including FlipChip, SIP and CSP processes. Compatibility and modular design shorten the cycle and speed iterative optimization.
Multi-Scenario Solution Design
Fusion design balancing high-speed transmission, high integration, high reliability, strong scalability and cost efficiency for demanding applications.
Diversified Modeling and Simulation
High-speed signal integrity, power integrity, EMC, mold-flow stress and thermal simulation to balance performance, reliability and cost.
Fully In-House Advanced Packaging
2nd-Gen FlipChip Advanced Packaging
The only domestic manufacturer achieving 2nd-gen Flip Chip advanced packaging, building a diversified packaging and testing business model.
16-Layer Stacked Die Packaging
SDBG ultra-thin 30um mass production enables 16-layer stacked die packaging, raising density, transmission rate and overall performance to industry-leading level.
99.98% Overall Product Yield
International high-end automated packaging equipment and strict in-process quality management ensure and monitor overall yield.
100M+ Chips Packaged and Tested
Cumulatively packaged and tested billions of chips, meeting market demand for high-performance, high-quality storage.
In-House Firmware, Software Development and Test Verification
Experienced R&D and Test Team
A team of nearly 100 firmware/software R&D and product test engineers, with core members holding 10+ years of development and testing experience.
Mainstream Vendor and Controller Resources
Adapted to major mainstream NAND and DRAM vendors at home and abroad, with support for controller chip selection.
Large Customer Design-in Experience
Experience from dozens of in-house firmware mass-production and large test projects, with cumulative shipments over 100 million units.
Standardized Test Verification
Continuously optimized automated test processes and tool chains, covering design and product verification from chip-level to board-level.
Smart Manufacturing Capacity
A class-1000 clean smart manufacturing center with planned chip packaging capacity of 100KK per year and memory module capacity of 30KK per year, offering both consumer-grade and industrial-grade product lines for stable production and supply.